Invention Grant
- Patent Title: DC link module for reducing DC link capacitance
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Application No.: US14131259Application Date: 2012-07-04
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Publication No.: US09912247B2Publication Date: 2018-03-06
- Inventor: Shu-Hung Henry Chung , Huai Wang
- Applicant: Shu-Hung Henry Chung , Huai Wang
- Applicant Address: HK Kowloon
- Assignee: CITY UNIVERSITY OF HONG KONG
- Current Assignee: CITY UNIVERSITY OF HONG KONG
- Current Assignee Address: HK Kowloon
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Priority: WOPCT/CN2011/076955 20110707
- International Application: PCT/CN2012/078155 WO 20120704
- International Announcement: WO2013/004180 WO 20130110
- Main IPC: H02M5/458
- IPC: H02M5/458 ; H02M5/42 ; H02M1/14

Abstract:
A dc link module for a power circuit includes a first connector for connecting to a first power conversion circuit, a second connector for connecting to a second power conversion circuit, wherein the second power conversion circuit is connected to a load circuit arranged to at least intermittently operate as a power source to the power circuit, at least one dc link capacitors arranged between said first connector and said second connector for processing a voltage signal received at said first connector or said second connector, and at least one voltage compensation circuits arranged between said first connector and said second connector, said one or more voltage compensation circuits arranged to generate a voltage signal to compensate an ac ripple component in a dc voltage signal appearing across the at least one dc link capacitor.
Public/Granted literature
- US20140347896A1 DC LINK MODULE FOR REDUCING DC LINK CAPACITANCE Public/Granted day:2014-11-27
Information query
IPC分类: