Invention Grant
- Patent Title: Alignment free solar cell metallization
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Application No.: US14292280Application Date: 2014-05-30
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Publication No.: US09911874B2Publication Date: 2018-03-06
- Inventor: Gabriel Harley , Taeseok Kim , Benjamin Ian Hsia
- Applicant: SUNPOWER CORPORATION
- Applicant Address: US CA San Jose
- Assignee: SunPower Corporation
- Current Assignee: SunPower Corporation
- Current Assignee Address: US CA San Jose
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01L31/18
Abstract:
A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a contact finger coupled to the semiconductor region via a plurality of weld regions with at least one of the weld regions being a partial weld.
Public/Granted literature
- US20150349154A1 ALIGNMENT FREE SOLAR CELL METALLIZATION Public/Granted day:2015-12-03
Information query
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