Invention Grant
- Patent Title: Semiconductor structure with multi spacer
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Application No.: US14858862Application Date: 2015-09-18
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Publication No.: US09911824B2Publication Date: 2018-03-06
- Inventor: Kuo-Cheng Ching , Ching-Wei Tsai , Chih-Hao Wang , Ying-Keung Leung
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/66 ; H01L29/78 ; H01L27/11 ; H01L27/02

Abstract:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a fin structure formed over a substrate and a gate structure formed across the fin structure. The semiconductor structure further includes a bottom spacer formed on a lower part of a sidewall of the gate structure and an upper spacer formed on an upper part of the sidewall of the gate structure. In addition, the upper spacer includes an air gap formed in a dielectric material.
Public/Granted literature
- US20170084714A1 SEMICONDUCTOR STRUCTURE WITH MULTI SPACER AND METHOD FOR FORMING THE SAME Public/Granted day:2017-03-23
Information query
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