- Patent Title: Structures and methods to enable a full intermetallic interconnect
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Application No.: US15244069Application Date: 2016-08-23
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Publication No.: US09911711B2Publication Date: 2018-03-06
- Inventor: Charles L. Arvin , Christopher D. Muzzy , Wolfgang Sauter
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Jennifer Anda
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00 ; H01L21/48 ; H01L21/52 ; H01L21/56
Abstract:
A method forming an interconnect structure includes depositing a first solder bump on a chip; depositing a second solder bump on a laminate, the second solder bump including a nickel copper colloid surrounded by a nickel or copper shell and suspended in a tin-based solder; aligning the chip with the laminate; performing a first reflow process to join the chip to the laminate; depositing an underfill material around the first solder bump and the second solder bump; and performing a second reflow process at a temperature that is lower than the first reflow process to convert the first solder bump and the second solder bump to an all intermetallic interconnect; wherein depositing the underfill material is performed before or after performing the second reflow process.
Public/Granted literature
- US20170179071A1 STRUCTURES AND METHODS TO ENABLE A FULL INTERMETALLIC INTERCONNECT Public/Granted day:2017-06-22
Information query
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