Invention Grant
- Patent Title: Interconnect structures with fully aligned vias
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Application No.: US15044154Application Date: 2016-02-16
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Publication No.: US09911690B2Publication Date: 2018-03-06
- Inventor: Daniel C. Edelstein , Nicholas C. Fuller , Elbert E. Huang , Satyanarayana V. Nitta , David L. Rath
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/532 ; H01L23/528 ; H01L21/768 ; H01L21/033 ; H01L21/02

Abstract:
A structure having fully aligned via connecting metal lines on different Mx levels. The structure may include a first metal line and a second metal line in a first ILD, a cap covering the first ILD, the second metal line and a portion of the first metal line, a second ILD on the cap, and a via that electrically connects the first metal line to a third metal line, wherein the third metal line is above the first metal line and runs perpendicular to the first metal line, the via is fully aligned to the first metal line and the third metal line, and the via electrically connects the first metal line to the third metal line.
Public/Granted literature
- US20160163640A1 INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS Public/Granted day:2016-06-09
Information query
IPC分类: