Invention Grant
- Patent Title: Method of manufacturing an electronic device, and electronic device manufacturing apparatus
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Application No.: US14452754Application Date: 2014-08-06
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Publication No.: US09911642B2Publication Date: 2018-03-06
- Inventor: Taiji Sakai , Nobuhiro Imaizumi
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2012-009728 20120120; JP2012-149410 20120703
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/762 ; H01L23/488 ; G21K5/02 ; H01L21/67 ; H01L23/00 ; B23K20/02 ; B23K20/24 ; B23K20/26 ; H01L21/268 ; H01L21/3213 ; B23K101/42
Abstract:
According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.
Public/Granted literature
- US20140342504A1 ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE MANUFACTURING APPARATUS Public/Granted day:2014-11-20
Information query
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