Invention Grant
- Patent Title: Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
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Application No.: US14852046Application Date: 2015-09-11
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Publication No.: US09911635B2Publication Date: 2018-03-06
- Inventor: Makoto Hirano
- Applicant: Hitachi Kokusai Electric Inc.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric, Inc.
- Current Assignee: Hitachi Kokusai Electric, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: JP2013-053182 20130315
- Main IPC: H01L21/673
- IPC: H01L21/673 ; C23C16/52 ; H01L21/677 ; C23C16/54

Abstract:
Provided is a substrate processing apparatus including a substrate container transfer device configured to transfer a substrate container accommodating a substrate and purge an inside of the substrate container; a purge gas supply unit installed at the substrate container transfer device and configured to supply a purge gas into the substrate container; a substrate container standby unit configured to accommodate the substrate container; a contact preventing unit installed at the substrate container standby unit and configured to prevent a contact between the purge gas supply unit and the substrate container standby unit when the substrate container is transferred to the substrate container standby unit by the substrate container transfer device; and a control unit configured to control the substrate container transfer device and the purge gas supply unit.
Public/Granted literature
Information query
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