Invention Grant
- Patent Title: Pattern decomposition for directed self assembly patterns templated by sidewall image transfer
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Application No.: US15397092Application Date: 2017-01-03
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Publication No.: US09911603B2Publication Date: 2018-03-06
- Inventor: Joy Cheng , Michael A. Guillorn , Chi-Chun Liu , Hsinyu Tsai
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L21/311 ; H01L21/308 ; H01L21/033 ; H01L21/768 ; C08L53/00 ; G03F7/00 ; G03F1/00
Abstract:
After forming spacers over a hard mask layer using a sidewall image transfer process, a neutral material layer is formed on the portions of the hard mask layer that are not covered by the spacers. The spacers and the neutral material layer guide the self-assembly of a block copolymer material. The microphase separation of the block copolymer material provides a lamella structure of alternating domains of the block copolymer material.
Public/Granted literature
- US20170162380A1 PATTERN DECOMPOSITION FOR DIRECTED SELF ASSEMBLY PATTERNS TEMPLATED BY SIDEWALL IMAGE TRANSFER Public/Granted day:2017-06-08
Information query
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