A method for manufacturing a carrier tape housing electronic components with seal materials includes preparing a tape-shaped main body with housing holes including bottom surfaces along a longitudinal direction, providing chip-shaped electronic components respectively into the housing holes, affixing a tape-shaped seal material having an adhesive layer on one principal surface to the tape-shaped main body such that the adhesive layer covers the housing holes and adheres to the electronic components, and forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions.