Invention Grant
- Patent Title: Mitigating wire capacitance in an integrated circuit
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Application No.: US14830938Application Date: 2015-08-20
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Publication No.: US09910951B2Publication Date: 2018-03-06
- Inventor: Kiran Vedantam , James G. Ballard , Hsiangwen Lin
- Applicant: ORACLE INTERNATIONAL CORPORATION
- Applicant Address: US CA Redwood Shores
- Assignee: ORACLE INTERNATIONAL CORPORATION
- Current Assignee: ORACLE INTERNATIONAL CORPORATION
- Current Assignee Address: US CA Redwood Shores
- Agency: Cooper Legal Group, LLC.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L27/02

Abstract:
Systems, methods, and other embodiments associated with mitigating wire capacitance are described. In one embodiment, a method includes loading, by at least a processor into an electronic memory, an electronic data structure that includes a design of an integrated circuit. The design defines layers of the integrated circuit and connections between structures and wire interconnects in the layers. The example method may also include generating, by at least the processor, a structured topology in the design by successively routing the wire interconnects throughout the layers according to coordinates of the structures in the design and weighted values associated with each of the structures to mitigate wire capacitance of the wire interconnects.
Public/Granted literature
- US20170053054A1 MITIGATING WIRE CAPACITANCE IN AN INTEGRATED CIRCUIT Public/Granted day:2017-02-23
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