Invention Grant
- Patent Title: Wiring body, wiring board, touch sensor, and method for producing wiring body
-
Application No.: US15508882Application Date: 2016-02-01
-
Publication No.: US09910552B2Publication Date: 2018-03-06
- Inventor: Takeshi Shiojiri , Takaharu Hondo
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: JP2015-021975 20150206; JP2015-208875 20151023
- International Application: PCT/JP2016/052923 WO 20160201
- International Announcement: WO2016/125744 WO 20160811
- Main IPC: G06F3/044
- IPC: G06F3/044 ; H05K1/03 ; H05K3/10 ; H05K3/28
Abstract:
A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1−H2|
Public/Granted literature
- US09880692B2 Wiring body, wiring board, touch sensor, and method for producing wiring body Public/Granted day:2018-01-30
Information query
