Invention Grant
- Patent Title: Patterning process and chemically amplified negative resist composition
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Application No.: US14886284Application Date: 2015-10-19
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Publication No.: US09910358B2Publication Date: 2018-03-06
- Inventor: Jun Hatakeyama , Masaki Ohashi
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-213633 20141020
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/32 ; G03F7/039 ; G03F7/40

Abstract:
A negative pattern is formed by coating a resist composition comprising a polymer comprising recurring units having a carboxyl and/or hydroxyl group optionally substituted with an acid labile group and an acid generator capable of generating fluorinated tetraphenylborate onto a substrate, prebaking, exposing, baking, and developing in an organic solvent so that the unexposed region of resist film is dissolved away and the exposed region of resist film is not dissolved. The resist composition exhibits a high sensitivity and high dissolution contrast during organic solvent development and forms a fine hole or trench pattern via positive/negative reversal.
Public/Granted literature
- US20160109803A1 PATTERNING PROCESS AND CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION Public/Granted day:2016-04-21
Information query
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