Invention Grant
- Patent Title: Passive thermal system providing an embedded interface for heat pipes
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Application No.: US14818600Application Date: 2015-08-05
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Publication No.: US09908643B2Publication Date: 2018-03-06
- Inventor: Alexander D. Smith , Armen Askijian , Daniel W. Field , James Grossman
- Applicant: WorldVu Satellites Limited
- Applicant Address: US VA Arlington
- Assignee: WorldVu Satellites Limited
- Current Assignee: WorldVu Satellites Limited
- Current Assignee Address: US VA Arlington
- Agency: Kaplan Breyer Schwarz, LLP
- Main IPC: B64G1/52
- IPC: B64G1/52 ; B64G1/58 ; F28D15/02 ; B64G1/10

Abstract:
A passive thermal system for use in aerospace vehicles includes a first passive thermal panel having at least one internal resident heat pipe, wherein the first passive thermal panel is further configured to provide an embedded interface between a portion of the resident heat pipe and at least one heat pipe extending from a neighboring passive thermal panel. The embedded interface is facilitated via an internal channel that is adjacent to the internal resident heat pipe. The channel is dimensioned and arranged to receive a portion of a heat pipe extending from a passive thermal panel that will be situated adjacent to the first passive thermal panel. The embedded interface is also facilitated by an arrangement that imparts a compressive force to the non-resident heat pipe that urges it against the resident heat pipe.
Public/Granted literature
- US20170036786A1 Passive Thermal System Providing an Embedded Interface for Heat Pipes Public/Granted day:2017-02-09
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