Invention Grant
- Patent Title: Substrate-free interconnected electronic mechanical structural systems
-
Application No.: US15069325Application Date: 2016-03-14
-
Publication No.: US09888600B2Publication Date: 2018-02-06
- Inventor: Ian Hovey , J. Robert Reid , David Sherrer , Will Stacy , Ken Vanhille
- Applicant: Nuvotronics, INC
- Applicant Address: US VA Radford
- Assignee: NUVOTRONICS, INC
- Current Assignee: NUVOTRONICS, INC
- Current Assignee Address: US VA Radford
- Agent Niels Haun
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/02 ; H01P1/04 ; H01P3/06 ; H01P5/12
Abstract:
Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.
Public/Granted literature
- US20160198584A1 SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS Public/Granted day:2016-07-07
Information query
