In some embodiments, a laminate substrate for mounting RF components can include a plurality of layers vertically stacked on top of each other. The laminate substrate includes a plurality of conductor pads, such that a respective conductor pad is positioned within a respective layer of the laminate substrate. The plurality of conductor pads includes an input pad on a first layer, an output pad on a second layer such that the output pad does not completely overlap with the input pad, and at least one intermediate pad between the input and output pads. The at least one intermediate pad defines a cutout reducing overlap between the at least one intermediate pad and one or more neighboring conductor pads. The laminate substrate can further include a plurality of connection features between the plurality of conductor pads to provide a signal path between the input pad and the output pad.