Invention Grant
- Patent Title: Single-layer metalization and via-less metamaterial structures
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Application No.: US13932998Application Date: 2013-07-01
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Publication No.: US09887465B2Publication Date: 2018-02-06
- Inventor: Ajay Gummalla , Maha Achour , Cheng Jung Lee , Vaneet Pathak , Gregory Poilasne
- Applicant: Tyco Electronics Services GMBH
- Applicant Address: CH
- Assignee: Tyco Electronics Services GmbH
- Current Assignee: Tyco Electronics Services GmbH
- Current Assignee Address: CH
- Main IPC: H01Q15/08
- IPC: H01Q15/08 ; H01Q1/38 ; H01Q5/307
Abstract:
Techniques and apparatus based on metamaterial structures provided for antenna and transmission line devices, including single-layer metallization and via-less metamaterial structures.
Public/Granted literature
- US20140022133A1 SINGLE-LAYER METALIZATION AND VIA-LESS METAMATERIAL STRUCTURES Public/Granted day:2014-01-23
Information query
