Invention Grant
- Patent Title: Light emitting device package
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Application No.: US14289191Application Date: 2014-05-28
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Publication No.: US09887325B2Publication Date: 2018-02-06
- Inventor: Ji Na Kwon , Jeong Hyun Na , Ho Ki Kwon
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2013-0061732 20130530
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/60 ; H01L33/56 ; H01L33/48 ; H01L33/58

Abstract:
Disclosed is a light emitting device package including a body including a recess, first and second electrodes disposed on the body, a light emitting device provided on the first electrode, and a molding part disposed on the light emitting device. At least one of the body and the molding part includes benzotriazol (BTA).
Public/Granted literature
- US20140353703A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2014-12-04
Information query
IPC分类: