- Patent Title: Semiconductor module having a light-transmissive insulating body
-
Application No.: US15252127Application Date: 2016-08-30
-
Publication No.: US09887311B2Publication Date: 2018-02-06
- Inventor: Tetsuya Kurosawa , Yoshihisa Imori
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2016-028778 20160218
- Main IPC: H01L31/173
- IPC: H01L31/173 ; H01L33/56 ; H01L33/62 ; H01L31/054 ; H01L31/048
Abstract:
A semiconductor module includes a light emitting element, a semiconductor element including a light receptor circuit disposed to receive light from the light emitting element, a light-transmissive insulating body disposed between the light emitting element and the semiconductor element, at least one of a first surface thereof facing the semiconductor element and a second surface thereof facing the light emitting element including a ragged region, a first light-transmissive bonding resin formed between the light emitting element and the light-transmissive insulating body, and a second light-transmissive bonding resin formed between the semiconductor element and the light-transmissive insulating body.
Public/Granted literature
- US20170244003A1 SEMICONDUCTOR MODULE HAVING A LIGHT-TRANSMISSIVE INSULATING BODY Public/Granted day:2017-08-24
Information query
IPC分类:
