Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15444238Application Date: 2017-02-27
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Publication No.: US09887285B1Publication Date: 2018-02-06
- Inventor: Tsuyoshi Oota , Masaru Furukawa
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2016-184627 20160921
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/16 ; H01L29/06 ; H01L27/07 ; H01L29/10

Abstract:
A semiconductor device comprises a silicon carbide layer, a first electrode, a second electrode, and a gate. The silicon carbide layer has first region of first conductivity type between the first and second electrodes and also the gate and second electrode. A second region of the first type is between the first electrode and the first region. A third region of second conductivity type is between the first electrode and the second region. A fourth region of the first type is between the first electrode and the third region. A fifth region of the first type is between the gate and the second region. The third region is between the fourth and fifth regions. A sixth region of the first type contacts the first electrode and is between the second region and this electrode. An insulation layer is between the gate and the third region and also the fifth region.
Information query
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