Invention Grant
- Patent Title: Methods of forming capacitors
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Application No.: US14877677Application Date: 2015-10-07
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Publication No.: US09887083B2Publication Date: 2018-02-06
- Inventor: Vassil N. Antonov , Vishwanath Bhat
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01G4/00
- IPC: H01G4/00 ; H01G5/00 ; H01G7/00 ; H01G9/00 ; H01G13/00 ; C23F1/00 ; C23F3/00 ; H01L21/02 ; H01L21/3105 ; H01L49/02

Abstract:
A method of forming a capacitor includes depositing a dielectric metal oxide layer of a first phase to a thickness no greater than 75 Angstroms over an inner conductive capacitor electrode material. The first phase dielectric metal oxide layer has a k of at least 15. Conductive RuO2 is deposited over and into physical contact with the dielectric metal oxide layer. Then, the RuO2 and the dielectric metal oxide layer are annealed at a temperature below 500° C. The RuO2 in physical contact with the dielectric metal oxide during the annealing facilitates a change of the dielectric metal oxide layer from the first phase to a second crystalline phase having a higher k than the first phase. The annealed dielectric metal oxide layer is incorporated into a capacitor dielectric region of a capacitor construction. Other implementations are disclosed.
Public/Granted literature
- US20160027642A1 Methods of Forming Capacitors Public/Granted day:2016-01-28
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