A wiring board for a fingerprint sensor includes an insulating board including a plurality of laminated insulating layers, a plurality of fingerprint reading outer strip-shaped electrodes, a plurality of fingerprint reading inner strip-shaped electrodes, and a projection electrode formed on the inner strip-shaped electrode and projecting toward a space between the outer strip-shaped electrodes, in which a horizontal distance between the projection electrode and the outer strip-shaped electrode is 5 μm to 20 μm, and an upper surface of the projection electrode is covered with the uppermost insulating layer by a thickness of 1 μm to 10 μm.