Invention Grant
- Patent Title: Package implemented with PCB and transparent substrate to contain and protect a MEMS device
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Application No.: US13831819Application Date: 2013-03-15
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Publication No.: US09885865B2Publication Date: 2018-02-06
- Inventor: Fusao Ishii
- Applicant: Fusao Ishii
- Assignee: Fusao Ishii
- Current Assignee: Fusao Ishii
- Agent Bo-In Lin
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G02B26/08 ; B81B7/00
Abstract:
The present invention provides a flip-chip package for MEMS device without time consuming wire-bonding. Bonding a silicon chip to a printed circuit board can be achieved by restricting the heat deformation of printed circuit board with adhered glass substrate which has similar heat expansion coefficient as silicon.
Public/Granted literature
- US20140268300A1 Packages of MEMS Public/Granted day:2014-09-18
Information query
