Invention Grant
- Patent Title: Intraosseous device couplers, drivers, kits, and methods
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Application No.: US13835383Application Date: 2013-03-15
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Publication No.: US09883853B2Publication Date: 2018-02-06
- Inventor: Steven Paul Woodard , Michel Yoon
- Applicant: Vidacare LLC
- Applicant Address: LU Luxembourg
- Assignee: TELEFLEX MEDICAL DEVICES S.À.R.L.
- Current Assignee: TELEFLEX MEDICAL DEVICES S.À.R.L.
- Current Assignee Address: LU Luxembourg
- Agency: Baker & Hostetler LLP
- Main IPC: A61B10/02
- IPC: A61B10/02 ; B23B31/113

Abstract:
This disclosure includes various embodiments of couplers for coupling intraosseous (IO) devices and drivers, and various embodiments of drivers and kits.
Public/Granted literature
- US20140276206A1 Intraosseous Device Couplers, Drivers, Kits, and Methods Public/Granted day:2014-09-18
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