Invention Grant
- Patent Title: Printed circuit board and package substrate
-
Application No.: US14753087Application Date: 2015-06-29
-
Publication No.: US09867296B2Publication Date: 2018-01-09
- Inventor: Dong Sun Kim , Sung Wuk Ryu , Hyun Seok Seo , Ji Haeng Lee
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: LRK Patent Law Firm
- Priority: KR10-2014-0080822 20140630
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K3/40 ; H01L23/498 ; H01L25/10 ; H01L25/00 ; H05K1/14 ; H01L23/00
Abstract:
A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.
Public/Granted literature
- US20150382463A1 PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE, AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-12-31
Information query
