Invention Grant
- Patent Title: Semiconductor memory card, printed circuit board for memory card and method of fabricating the same
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Application No.: US14386637Application Date: 2013-03-20
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Publication No.: US09867288B2Publication Date: 2018-01-09
- Inventor: Seol Hee Lim
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: LRK Patent Law Firm
- Priority: KR10-2012-0028199 20120320
- International Application: PCT/KR2013/002313 WO 20130320
- International Announcement: WO2013/141611 WO 20130926
- Main IPC: H05K1/05
- IPC: H05K1/05 ; H05K1/11 ; H05K1/18 ; H05K3/24 ; C25D3/14 ; C25D3/16 ; C25D5/02 ; C25D5/12

Abstract:
A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.
Public/Granted literature
- US20150016049A1 SEMICONDUCTOR MEMORY CARD, PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-01-15
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