Invention Grant
- Patent Title: Circuit board with corner hollows
-
Application No.: US14451757Application Date: 2014-08-05
-
Publication No.: US09867282B2Publication Date: 2018-01-09
- Inventor: Suming Hu , Neil McLellan , Andrew K W Leung , Jianguo Li
- Applicant: Suming Hu , Neil McLellan , Andrew K W Leung , Jianguo Li
- Applicant Address: CA Markham US CA Sunnyvale
- Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee: ATI Technologies ULC,Advanced Micro Devices, Inc.
- Current Assignee Address: CA Markham US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H05K7/00 ; H05K1/02 ; H05K3/00 ; H01L23/13 ; H05K3/34 ; H01L23/498
Abstract:
A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes.
Public/Granted literature
- US20150049441A1 CIRCUIT BOARD WITH CORNER HOLLOWS Public/Granted day:2015-02-19
Information query
