- Patent Title: Planarity-tolerant reworkable interconnect with integrated testing
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Application No.: US15137123Application Date: 2016-04-25
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Publication No.: US09865569B2Publication Date: 2018-01-09
- Inventor: Bing Dang , John U. Knickerbocker , Yang Liu , Yu Luo , Steven L. Wright
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Law Office of Charles W. Peterson, Jr.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L25/00 ; H01L23/498 ; H01L21/56 ; H01L23/31 ; H01L21/683 ; H01L23/50 ; H01L23/13 ; H01L21/66 ; H01L23/48
Abstract:
A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.
Public/Granted literature
- US20160240513A1 PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING Public/Granted day:2016-08-18
Information query
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