Invention Grant
- Patent Title: Shielded conductive path
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Application No.: US14904516Application Date: 2014-07-16
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Publication No.: US09865376B2Publication Date: 2018-01-09
- Inventor: Masahiro Hagi
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Mie
- Agency: Oliff PLC
- Priority: JP2013-161367 20130802
- International Application: PCT/JP2014/068896 WO 20140716
- International Announcement: WO2015/016065 WO 20150205
- Main IPC: H01B5/08
- IPC: H01B5/08 ; H01B7/282 ; H02G3/04 ; H02G3/06

Abstract:
Infiltration of water into a shield pipe is prevented. A shielded conductive path includes a tubular braided wire, a shield pipe connected to the braided wire, an electric wire bundle inserted into the braided wire and the shield pipe, a heat-shrinkable tube that is disposed so as to cover the braided wire and is thermally shrunk to bring the braided wire into intimate contact with an outer circumference of the electric wire bundle, a filler (18) with which voids between the electric wire bundle and the heat-shrinkable tube are filled, and a tubular waterstopping member that covers a region of the braided wire between the heat-shrinkable tube and the shield pipe in a state in which two end portions of the tubular waterstopping member are in intimate contact with an outer circumferential surface of the heat-shrinkable tube and the outer circumferential surface of the shield pipe in a liquidtight manner.
Public/Granted literature
- US20160148722A1 SHIELDED CONDUCTIVE PATH Public/Granted day:2016-05-26
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