Invention Grant
- Patent Title: Semiconductor memory with data line capacitive coupling
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Application No.: US15435149Application Date: 2017-02-16
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Publication No.: US09865336B2Publication Date: 2018-01-09
- Inventor: Jhon-Jhy Liaw
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G11C11/419
- IPC: G11C11/419 ; G11C11/412 ; G11C11/00 ; G11C7/12

Abstract:
A semiconductor memory includes a first data line, a second data line, a first coupling line, a second coupling line, a first plurality of transistors, and a second plurality of transistors. The first coupling line is configured to be capacitively coupled with the first data line. The second coupling line is configured to be capacitively coupled with the second data line. The first plurality of transistors are configured to transmit a first voltage to the first coupling line and the second coupling line in response to a first control signal. The second plurality of transistors are configured to transmit a second voltage to the first coupling line, the second coupling line, or a combination thereof in response to a second control signal and a third control signal.
Public/Granted literature
- US20170162256A1 SEMICONDUCTOR MEMORY WITH DATA LINE CAPACITIVE COUPLING Public/Granted day:2017-06-08
Information query
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