Invention Grant
- Patent Title: Mechanical seed coupling
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Application No.: US13838392Application Date: 2013-03-15
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Publication No.: US09863453B2Publication Date: 2018-01-09
- Inventor: Joseph Lovorn , Larry Gurley
- Applicant: Mitsubishi Polycrystalline Silicon America Corporation (MIPSA) , MITSUBISHI MATERIALS CORPORATION
- Applicant Address: US AL Theodore JP Tokyo
- Assignee: Mitsubishi Polycrystalline Silicon America Corporation (MIPSA),MITSUBISHI MATERIALS CORPORATION
- Current Assignee: Mitsubishi Polycrystalline Silicon America Corporation (MIPSA),MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: US AL Theodore JP Tokyo
- Agency: Locke Lord LLP
- Main IPC: F16B7/04
- IPC: F16B7/04 ; B28D5/02

Abstract:
An apparatus and method of manufacturing silicon seed rod in which two silicon seeds are joined into one long silicon seed rod by mechanical coupling. A mechanical seed coupler is a body in having an outer wall, an upper surface with an upper aperture, a lower surface with a lower aperture, and an inner wall surrounding an inner space. The mechanical seed couple can be of a shape including a cylinder shape, an elliptical tube shape, a rectangular tube shape and a square tube shape. Furthermore the mechanical seed coupler can be of unitary construction, made from one solid piece of material, or it can be composed of subparts.
Public/Granted literature
- US20140270933A1 MECHANICAL SEED COUPLING Public/Granted day:2014-09-18
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