Invention Grant
- Patent Title: Reduced wire profile stent
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Application No.: US15082434Application Date: 2016-03-28
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Publication No.: US09861506B2Publication Date: 2018-01-09
- Inventor: Michael Ryan , James M. Carlson
- Applicant: Cook Medical Technologies LLC
- Applicant Address: US IN Bloomington
- Assignee: Cook Medical Technologies LLC
- Current Assignee: Cook Medical Technologies LLC
- Current Assignee Address: US IN Bloomington
- Agency: Brinks Gilson & Lione
- Main IPC: C25F3/16
- IPC: C25F3/16 ; A61F2/90 ; A61F2/86

Abstract:
Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.
Public/Granted literature
- US20160206453A1 REDUCED WIRE PROFILE STENT Public/Granted day:2016-07-21
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