Invention Grant
- Patent Title: Electronic assembly and method of manufacture same
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Application No.: US15015609Application Date: 2016-02-04
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Publication No.: US09756741B2Publication Date: 2017-09-05
- Inventor: Mike Blossfeld , Luis Fermando Sanchez
- Applicant: TRW Automotive U.S. LLC
- Applicant Address: US MI Livonia
- Assignee: TRW Automotive U.S. LLC
- Current Assignee: TRW Automotive U.S. LLC
- Current Assignee Address: US MI Livonia
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01R13/66 ; H01R12/50 ; H01R12/72 ; H01R13/506 ; H01R43/20 ; H01R13/41 ; H01R43/16 ; H01R43/18 ; H05K5/02 ; H05K7/14 ; H01R13/447 ; H02G3/08 ; H02G3/16

Abstract:
An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by inter-engaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.
Public/Granted literature
- US20160157364A1 ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING SAME Public/Granted day:2016-06-02
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