Invention Grant
- Patent Title: Electrical switch assembly
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Application No.: US14619167Application Date: 2015-02-11
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Publication No.: US09756740B2Publication Date: 2017-09-05
- Inventor: Chiu Keung Loong
- Applicant: Defond Components Limited
- Applicant Address: CN Chai Wan, Hong Kong
- Assignee: Defond Components Limited
- Current Assignee: Defond Components Limited
- Current Assignee Address: CN Chai Wan, Hong Kong
- Agency: Leydig Voit and Mayer
- Priority: EP14155593 20140218
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01H9/52 ; H01H1/58 ; H05K7/20

Abstract:
An electrical switch assembly for an electrical appliance having an electrical load such as a motor, includes a housing with an opening, switch terminals, and an on/off mechanical switching module. The switch assembly includes an electronic control module operable with a semiconductor switching device to control operation of the load, and a heat sink in thermal contact with the switching device for dissipating heat. The heat sink is electrically conductive and is in electrical circuit connection with a first terminal of the switching device and one of the switch terminals. The heat sink closes the opening and forms part of the housing.
Public/Granted literature
- US20150237744A1 ELECTRICAL SWITCH ASSEMBLY Public/Granted day:2015-08-20
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