A multilayer laminated substrate structure includes plural substrate layers stacked with each other, and a conductive via portion. One of the substrate layers is provided with a through hole. The conductive via portion includes a first signal conductive pad having a first rib, a second signal conductive pad having a second rib, and a conductive body which is disposed in the through hole and is electrically connected to the first rib and the second rib. The first signal conductive pad and the second signal conductive pad are disposed on two opposite surfaces of the substrate layer, and the first rib and the second rib are arranged in a staggered manner in relation to each other.