Invention Grant
- Patent Title: Housing wall
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Application No.: US14907194Application Date: 2014-07-04
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Publication No.: US09756155B2Publication Date: 2017-09-05
- Inventor: Walter Ettel , Manfred Bammer , Gernot Schmidt
- Applicant: SIBERSDORF LABOR GMBH , AIT AUSTRIAN INSTITUTE OF TECHNOLOGY GMBH
- Applicant Address: DE Seibersdorf AT Vienna
- Assignee: Seibersdorf Labor GmbH,AIT Austrian Institute of Technology GmbH
- Current Assignee: Seibersdorf Labor GmbH,AIT Austrian Institute of Technology GmbH
- Current Assignee Address: DE Seibersdorf AT Vienna
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: ATA50467/2013 20130724
- International Application: PCT/AT2014/050154 WO 20140704
- International Announcement: WO2015/010147 WO 20150129
- Main IPC: H04M1/02
- IPC: H04M1/02 ; H01Q1/24 ; H01Q7/00 ; H04R1/02 ; H01Q1/40 ; H01Q1/42 ; H04B1/3827 ; H04B5/00
Abstract:
A housing wall for a data communications device includes a metallic and electrically conductive main body. A slotted area having a number of slots is provided in a region of the housing wall, in such a way that in a region of the slotted area the housing wall is permeable to magnetic fields for inductively coupling-in signals for wireless communication.
Public/Granted literature
- US20160165018A1 HOUSING WALL Public/Granted day:2016-06-09
Information query
