Invention Grant
- Patent Title: Low cost CMOS chip with tape automated bonding (polyamide)
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Application No.: US14962157Application Date: 2015-12-08
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Publication No.: US09755642B2Publication Date: 2017-09-05
- Inventor: Shivaling Shrishail Mahant Shetti , Anand Baligatti , Prakash Donur , Veeranna Hooli , Ranganath Y Goudar , Anil Agasar , Manjunathreddi G Baragundi
- Applicant: Shivaling Shrishail Mahant Shetti
- Agency: The Law Office of Austin Bonderer, PC
- Agent Austin Bonderer
- Priority: IN6200/CHE/2014 20141208
- Main IPC: H03K19/018
- IPC: H03K19/018 ; H03K19/0185

Abstract:
In view of the foregoing, an embodiment herein provides a low cost system. The system includes a bipolar array, a CMOS chip. The bipolar array includes one or more bipolar integrated circuits. The CMOS chip is programmed by a single level of metal. The bipolar array and the CMOS chip is mounted on a substrate using TAB polyamide. The TAB includes a polyamide film with one or more metal patterns chemically etched by programming three metal layers simultaneously to obtain one or more components. The one or more components are mounted in a package, and a small system can be realized. An external capacitor supplies an ac power source to the bipolar array. The bipolar array produces a rectified voltage and a lower voltage power for the enhanced gate array. An output of the enhanced gate array drives bipolar drivers of DC motor, stepper motor, BLDC motor, and LED assemblies.
Public/Granted literature
- US20160164524A1 LOW COST CMOS CHIP WITH TAPE AUTOMATED BONDING (POLYAMIDE) Public/Granted day:2016-06-09
Information query
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