A light emitting device includes a base member including a conductive member; a light mining element arranged on the base member, the light emitting element having a first surface, a second surface opposing the first surface, and at least one lateral surface between the first surface and the second surface; a die-bonding resin bonding the base member and the second surface; a first protective film continuously covering the base member, the die-bonding resin, the at least one lateral surface, and the first surface; and a second protective film continuously covering the base member, the die-bonding resin, the at least one lateral surface and the first surface of the light emitting element, over the first protective film, the second protective film having a linear expansion coefficient that is smaller than a linear expansion coefficient of the die-bonding resin and larger than a linear expansion coefficient of the first protective film.