Invention Grant
- Patent Title: Method of detaching sealing member of light emitting device
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Application No.: US15270874Application Date: 2016-09-20
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Publication No.: US09755121B2Publication Date: 2017-09-05
- Inventor: Shingo Omura
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2013-053451 20130315
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/54 ; H01L33/00 ; H01L33/50 ; H01L33/56 ; H01L33/62 ; H01L33/52
Abstract:
A method of detaching a sealing member of a light emitting device which has a substrate, alight emitting element mounted on the substrate and a sealing member that seals the light emitting element, wherein a release layer and/or an air layer is/are provided between the substrate and the sealing member; and the sealing member is detached from the substrate at the release layer and/or the air layer.
Public/Granted literature
- US20170012184A1 METHOD OF DETACHING SEALING MEMBER OF LIGHT EMITTING DEVICE Public/Granted day:2017-01-12
Information query
IPC分类:
