Invention Grant
- Patent Title: Light emitting device and method for manufacturing light emitting device
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Application No.: US15073291Application Date: 2016-03-17
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Publication No.: US09755108B2Publication Date: 2017-09-05
- Inventor: Satoshi Wada , Yoshiki Taniyama
- Applicant: TOYODA GOSEI CO., LTD.
- Applicant Address: JP Kiyosu-Shi, Aichi-Ken
- Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee Address: JP Kiyosu-Shi, Aichi-Ken
- Agency: McGinn IP Law Group, PLLC.
- Priority: JP2015-058217 20150320
- Main IPC: H01L33/22
- IPC: H01L33/22 ; H01L33/48 ; H01L33/54
Abstract:
A light emitting device includes: a semiconductor light emitting element having a sapphire substrate and a semiconductor layer; a mounting board; and a light transmission member, wherein: the sapphire substrate is bonded to the light transmission member by an adhesive material; the semiconductor light emitting element is mounted on the mounting board in the form of a flip-chip; and a roughened peripheral edge part is formed in the sapphire substrate in the mounting board side.
Public/Granted literature
- US20160276557A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2016-09-22
Information query
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