Invention Grant
- Patent Title: Copper structures with intermetallic coating for integrated circuit chips
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Application No.: US14944054Application Date: 2015-11-17
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Publication No.: US09754909B2Publication Date: 2017-09-05
- Inventor: Hunt Hang Jiang
- Applicant: Monolithic Power Systems, Inc.
- Applicant Address: US CA San Jose
- Assignee: Monolithic Power Systems, Inc.
- Current Assignee: Monolithic Power Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Okamoto & Benedicto LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00
Abstract:
An integrated circuit (IC) chip includes a copper structure with an intermetallic coating on the surface. The IC chip includes a substrate with an integrated circuit. A metal pad electrically connects to the integrated circuit. The copper structure electrically connects to the metal pad. A solder bump is disposed on the copper structure. The surface of the copper structure has a coating of intermetallic. The copper structure can be a redistribution layer and a copper pillar that is disposed on the redistribution layer.
Public/Granted literature
- US20160351520A1 COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT CHIPS Public/Granted day:2016-12-01
Information query
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