Invention Grant
- Patent Title: Semiconductor structure and method of fabricating the same
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Application No.: US14769599Application Date: 2014-02-21
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Publication No.: US09754899B2Publication Date: 2017-09-05
- Inventor: Shoa Siong Raymond Lim , Hwee Seng Jimmy Chew
- Applicant: Advanpack Solutions PTE LTD
- Applicant Address: SG Singapore
- Assignee: Advanpack Solutions PTE LTD
- Current Assignee: Advanpack Solutions PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Marshall, Gerstein & Borun LLP
- International Application: PCT/SG2014/000074 WO 20140221
- International Announcement: WO2014/129976 WO 20140828
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/00 ; H01L23/544 ; H01L21/48 ; H01L21/56 ; H01L23/495 ; H01L23/498
Abstract:
A semiconductor structure and a method of fabricating the same. The semiconductor structure comprises: a layer element, one or more supporting elements disposed on a first surface of the layer element, and one or more anchoring elements disposed within the layer element and connected to the one or more supporting elements to couple the one or more supporting elements to the layer element to strengthen the layer element.
Public/Granted literature
- US20160013139A1 Semiconductor Structure and Method of Fabricating the Same Public/Granted day:2016-01-14
Information query
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