A system for cooling a heat producing device is provided. The system can include an air mover (110) wherein at least a portion of the discharge airflow (115) is directed radially outward. The system can also include a thermal conduit (120) and a thermal member (130). The thermal member can have a first surface (135), a second surface (140) and at least one integrally formed heat exchange surface (150). At least a portion of the heat exchange surface (150) can be at least partially disposed in the air mover discharge airflow (115). At least a portion of the first surface (135) can be disposed proximate the thermal conduit (120). At least a portion of the second surface (140) can be disposed proximate the air mover (110).