Invention Grant
- Patent Title: Method of electrically isolating leads of a lead frame strip by laser beam cutting
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Application No.: US15254454Application Date: 2016-09-01
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Publication No.: US09754834B2Publication Date: 2017-09-05
- Inventor: Nee Wan Khoo , Vigneswaran Letcheemana
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/46
- IPC: H01L21/46 ; H01L21/78 ; H01L21/301 ; H01L21/44 ; H01L21/50 ; H01L21/48 ; B23K26/362 ; B23K26/40 ; B23K26/402 ; H01L21/56 ; H01L21/66 ; H01L23/00 ; B23K101/40 ; B23K103/16 ; B23K103/00
Abstract:
A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to each of the die paddles, the unit lead frames are covered with a molding compound after the semiconductor dies are attached to the die paddles, and a laser beam is directed at regions of the periphery of each unit lead frame where the leads are located thereby forming spaced apart cuts in the periphery of each unit lead frame. The spaced apart cuts sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in the regions of the periphery where the leads are located so that the molding compound remains intact between the spaced apart cuts.
Public/Granted literature
- US20160372374A1 Method of Electrically Isolating Leads of a Lead Frame Strip by Laser Beam Cutting Public/Granted day:2016-12-22
Information query
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