Invention Grant
- Patent Title: Semiconductor wafer and method of producing the same
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Application No.: US13473712Application Date: 2012-05-17
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Publication No.: US09754832B2Publication Date: 2017-09-05
- Inventor: Florian Schmitt , Heimo Scheucher , Michael Ziesmann
- Applicant: Florian Schmitt , Heimo Scheucher , Michael Ziesmann
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP11168688 20110603
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/78 ; H01L23/58 ; H01L21/683
Abstract:
A semiconductor wafer (100) having a regular pattern of predetermined separation lanes (102) is provided, wherein the predetermined separation lanes (102) are configured in such a way that the semiconductor wafer is singularizable along the regular pattern.
Public/Granted literature
- US20120306056A1 Semiconductor wafer and method of producing the same Public/Granted day:2012-12-06
Information query
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