Invention Grant
- Patent Title: Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic device
-
Application No.: US15132790Application Date: 2016-04-19
-
Publication No.: US09754830B2Publication Date: 2017-09-05
- Inventor: Taiga Fukumori , Daisuke Mizutani , Mamoru Kurashina
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2012-161495 20120720
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/768 ; H01L23/48 ; H01L23/66 ; H01L23/00 ; H01L23/498
Abstract:
A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.
Public/Granted literature
Information query
IPC分类:
