Invention Grant
- Patent Title: Bond chuck, methods of bonding, and tool including bond chuck
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Application No.: US15341769Application Date: 2016-11-02
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Publication No.: US09754813B2Publication Date: 2017-09-05
- Inventor: Chih-Hui Huang , Yen-Chang Chu , Kuan-Liang Liu , Ping-Yin Liu , Cheng-Yuan Tsai , Yeur-Luen Tu , Chia-Shiung Tsai , Ru-Liang Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/67 ; H01L21/683 ; B32B37/10 ; H01L21/68 ; H01L23/00
Abstract:
A bonding chuck is discussed with methods of using the bonding chuck and tools including the bonding chuck. A method includes loading a first wafer on first surface of a first bonding chuck, loading a second wafer on a second bonding chuck, and bonding the first wafer to the second wafer. The first surface is defined at least in part by a first portion of a first spherical surface and a second portion of a second spherical surface. The first spherical surface has a first radius, and the second spherical surface has a second radius. The first radius is less than the second radius.
Public/Granted literature
- US20170053823A1 Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck Public/Granted day:2017-02-23
Information query
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