Invention Grant
- Patent Title: Assembled structure and electronic device including same
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Application No.: US14926911Application Date: 2015-10-29
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Publication No.: US09754741B2Publication Date: 2017-09-05
- Inventor: Kouta Hibino
- Applicant: KYOCERA CORPORATION
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Duane Morris LLP
- Priority: JP2014-220180 20141029
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H01H13/88

Abstract:
An assembled structure includes a metal plate having a first main surface and a second main surface, and having a through hole, as well as a resin member assembled with the metal plate and disposed on the second main surface side so as to have a portion fitted within the through hole. Assuming that an opening when the through hole is viewed in a plan view has a first width at a point along the opening and a second width measured in parallel to the first width at a point shifted toward the outer side of the opening, a combination of the first width and the second width can be determined such that the second width is larger than the first width.
Public/Granted literature
- US20160126033A1 ASSEMBLED STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME Public/Granted day:2016-05-05
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