Invention Grant
- Patent Title: Printed circuit board
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Application No.: US14568544Application Date: 2014-12-12
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Publication No.: US09730319B2Publication Date: 2017-08-08
- Inventor: Man Hue Choi , Min Jae Kim , Se Woong Na , Hyun Gyu Park , In Hee Cho , Seung Kwon Hong
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2013-0154863 20131212
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K3/28 ; G02F1/1335

Abstract:
Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.
Public/Granted literature
- US20150173180A1 PRINTED CIRCUIT BOARD Public/Granted day:2015-06-18
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