Invention Grant
- Patent Title: Mechanical enclosures for a communication device
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Application No.: US14682366Application Date: 2015-04-09
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Publication No.: US09730002B2Publication Date: 2017-08-08
- Inventor: Reinierus van der Lee , John Walley
- Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H04W4/00 ; H04B1/3888 ; H04L29/08

Abstract:
The present disclosure describes a mechanical chassis having one or more conductive regions separated by one or more non-conductive regions. When a magnetic field contacts, or is sufficiently proximate to, this communication device, the magnetic field induces one or more eddy currents that flow in one or more closed loops around a surface of the one or more conductive regions. The one or more non-conductive regions confine the one or more eddy currents to the one or more conductive regions. The magnetic fields generated by these one or more eddy currents are weaker than a magnetic field generated by eddy currents in a communication device having a mechanical chassis constructed entirely of conductive material.
Public/Granted literature
- US20150296328A1 Mechanical Enclosures For A Communication Device Public/Granted day:2015-10-15
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