Invention Grant
- Patent Title: Connection device and reception device
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Application No.: US15036750Application Date: 2014-11-13
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Publication No.: US09728914B2Publication Date: 2017-08-08
- Inventor: Yoshitaka Yoshino , Satoru Tsuboi , Tomomichi Murakami , Makoto Makishima
- Applicant: Sony Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2013-242295 20131122
- International Application: PCT/JP2014/005700 WO 20141113
- International Announcement: WO2015/075910 WO 20150528
- Main IPC: H01R24/58
- IPC: H01R24/58 ; H01R24/50 ; H01R107/00

Abstract:
A connection device includes a rod-shaped electrode, a plurality of cylindrical electrodes through which the rod-shaped electrode passes, the plurality of cylindrical electrodes being sequentially exposed on a surface in order from a front end side of the rod-shaped electrode, an insulation section configured to insulate the rod-shaped electrode and the plurality of cylindrical electrodes from each other, and a plurality of connection terminals electrically connected to the rod-shaped electrode and the plurality of cylindrical electrodes in a vicinity of a rear end of the rod-shaped electrode, the plurality of connection terminals being protruded from a rear side.
Public/Granted literature
- US20160276788A1 CONNECTION DEVICE AND RECEPTION DEVICE Public/Granted day:2016-09-22
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